Købe ECW-U1H563JB9 med BYCHPS
Køb med garanti
ECW-U1H563JB9
- Varenummer:
- ECW-U1H563JB9
- Fabrikant:
- Panasonic
- Beskrivelse:
- CAP FILM 0.056UF 5% 50VDC 1913
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 17319 Pieces
- Datablad:
- ECW-U1H563JB9.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ECW-U1H563JB9, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ECW-U1H563JB9 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | 50V |
|---|---|
| Spændingsbedømmelse - AC: | - |
| Tolerance: | ±5% |
| Afslutning: | Solder Pads |
| Størrelse / Dimension: | 0.189" L x 0.130" W (4.80mm x 3.30mm) |
| Serie: | ECW-U(B) |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1913 (4833 Metric) |
| Andre navne: | ECW-U1H563JN9 ECWU1H563JB9 ECWU1H563JN9 PCF1055TR |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | ECW-U1H563JB9 |
| Blyafstand: | - |
| Højde - Siddende (Max): | 0.087" (2.20mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 0.056µF ±5% Film Capacitor 50V Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked 1913 (4833 Metric) |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked |
| Beskrivelse: | CAP FILM 0.056UF 5% 50VDC 1913 |
| kapacitans: | 0.056µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til ECW-U1H563JB9
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers